Global IO Link Market report is an insightful and actionable market report which is always in demand by the businesses for the growth and success. It becomes easy to analyse the actions of key players and its effect on the sales, import, export, revenue and CAGR values with this Global IO Link Market report. Overview of the market is analysed with respect to market players in the form of customers, businesses or clients. Here, market report presents the company profile, product specifications, capacity, production value, and 2018-2025 market shares for each company. Clients can explore new possibilities which are made feasible with the superior research methodologies, research tools and rich experiences.
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The Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.
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Global IO Link Market, By Component (IO-Link Masters, IO-Link Devices), By Application (Machine Tool, Handling and Assembly Automation, Packaging, Intralogistics), By Industry (Discrete, Hybrid, Process), By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)– Industry Trends and Forecast to 2026
The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.
Major Market Competitors/Players: Global IO Link Market
Few of the major competitors currently working in the IO Link Market are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs, Datalogic S.p.A., Comtrol, Beckhoff Automation GmbH & Co. KG, Baumer, Bosch Rexroth AG, ABB, Belden Inc., AVENTICS GmbH, and Weidmüller Interface GmbH & Co. KG.
Table of Contents:
- Market Segmentation
- Market Overview
- Executive Summary
- Premium Insights
- By Component
- Product Type
- Industry Type
- North America
- South America
- Middle East & Africa
- Company Landscape
- Company Profiles
- Related Reports
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IO Link is an industrial communication networking device that is used for interlinking sensors to a high level fieldbus or ethernet communication protocol. It provides the data from these sensors that can be used for monitoring and hence, helps in optimizing the resources being utilized in the said industry.
- Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth
- IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols
- IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to restrain the market growth
- Lack of standardization of IO Links is another factor that is expected to restrain the market growth
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- By Component
- IO-Link Masters
- IO-Link Devices
- Sensor Nodes
- Radio-Frequency Identification (RFID) Read Heads and Others
- By Application
- Machine Tool
- Handling and Assembly Automation
- By Industry
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